The Thermo Scientific ExSolve wafer TEM prep (WTP) DualBeam (FIB-SEM) dramatically reduces the cost and increases the speed of sample preparation, thus providing semiconductor and data storage manufacturers with a quick and easy access to the data needed to monitor and verify process performance. The ExSolve DualBeam can prepare site-specific TEM lamella, sampling many sites per wafer in a fully-automated process inside the fab. This gives semiconductor manufacturers much more information than conventional approaches, while at the same time reducing the capital cost of sample preparation by up to 70 percent.
