Electrical Failure Analysis (EFA) Systems

Shrinking technologies, new materials, and more complex structures are making defects increasingly common - especially when the circuit design is particularly sensitive to process variation. These non-visual defects reveal themselves as electrical faults that downgrade device performance, threaten reliability, and destroy yield. What is more, they become even more complex when failures occur at the device packaging stage. High-density interconnects, wafer-level stacking, flexible electronics, and integral substrates mean that failure-inducing defects have more places to hide-making characterization more difficult and more critical than ever. Thermo Scientific's latest next-generation products focus on advanced analytical capabilities for failure analysis and process control. They are designed to improve quality control and yield in the manufacture of 3D NAND, logic, DRAM, analog and display devices and consequently help increase productivity in semiconductor fabs and labs.