Advanced logic and memory manufacturing processes are becoming more reliant on fast turnaround of precise structural and analytical data. These processes need to be able to quickly calibrate tool sets, diagnose yield excursions, and optimize process yields. At technology nodes below 28nm, especially in cases in which 3D and advanced device designs are being implemented, conventional SEM or optical-based analysis and inspection tools run into challenges that limit their ability to provide robust and reliable data. The Thermo Scientific Metrios AX transmission electron microscope (TEM) is the first TEM dedicated to providing the fast, precise characterization and reference metrology needed for semiconductor manufacturers in order to develop and control their wafer fabrication processes and consequently accelerate profitable yield.
