With time-to-yield being critical to profitability, it is too expensive for advanced foundries, integrated device manufacturers and fabless companies to wait until after dicing and packaging in order to identify the source of electrical faults. With that in mind, the Thermo Scientific Meridian WaferScan and WS-DP Systems were designed to perform electrical fault analysis of full semiconductor wafers up to 300mm under production conditions. It enables faster defect localization by using production testers, load boards, and probe cards.
